Server mit Modularem Wärmemanagement

Details

Veröffentlichungs-Nr.

EP4791132

Anmeldetag

8. Januar 2026

Veröffentlichung

12. August 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

A cooling module (100) associable with a heat-generating electronic device (80) of a server (30) includes a casing (102) having a hollow interior (104) and at least one heat removal device (120) arranged within the hollow interior (104). A fluid flow path (124) of a primary cooling fluid (C1) extends through the casing (102) and the at least one heat removal device (120) defines a portion of the fluid flow path (124). The primary cooling fluid (C1) is configured to absorb heat from the heat-generating electronic device (80) within the cooling module (100).

Anmelder

Firma

Carrier Corporation

Land

🇺🇸 USA

Fachgebiete