Leistungsmodule
Anmelder: STMicroelectronics International N.V. 🇨🇭
Details
- Veröffentlichungs-Nr.
- EP4791176
- Anmeldetag
- 28. Januar 2026
- Veröffentlichung
- 12. August 2026
- Rechtsraum
- EP
Abstract
The present disclosure is directed to a power module that powers and controls various electronics, such an electric motor of an electric vehicle. The device includes a plurality of dies on a substrate, and a molding covering the dies and the substrate. The substrate is positioned on a heat sink. Connection pins are electrically coupled to the dies, and extend from the dies, through the molding, and into a printed circuit board. The printed circuit board is spaced from an upper surface of the molding.
Anmelder
- Firma
- STMicroelectronics International N.V.
- Land
- 🇨🇭 Schweiz
Schweizer Gesellschaft des Halbleiterkonzerns STMicroelectronics, die Chips und Sensoren für Automobiltechnik, Industrie und Unterhaltungselektronik entwickelt.
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