Leistungsvorrichtung

Details

Veröffentlichungs-Nr.

EP4791181

Anmeldetag

29. Dezember 2025

Veröffentlichung

12. August 2026

Rechtsraum

EP

Abstract

The power device (1) includes power module (2, 2a, 2b, 2c, 2d, 2e). Each power module (2, 2a, 2b, 2c, 2d, 2e) includes a substrate (3), a chip (4), metal pillars (5), a molding material (6) and current pins. The substrate (3) includes a metal surface (31). The chip (4) is disposed on the metal surface (31). The metal pillars (5) are disposed on the metal surface (31) along a normal direction of the substrate (3). The molding material (6) covers the substrate (3), the chip (4) and the metal pillars (5). The lateral surface (53) of each metal pillar (5) is totally covered by the molding material (6). The top surface (51) of each metal pillar (5) is exposed from a surface of the molding material (6). The first terminal (711) of the current pin (71) of each power module (2, 2a, 2b, 2c, 2d, 2e) is disposed on the top surface (51) of corresponding metal pillar (5) by welding or sintering. The second terminal (712) of corresponding current pin (71) of corresponding power module (2, 2a, 2b, 2c, 2d, 2e) is disposed on the top surface (51) of corresponding metal pillar (5) of another power module (2, 2a, 2b, 2c, 2d, 2e) by welding or sintering.

Anmelder

Firma

Delta Electronics, Inc.

Land

🇹🇼 Taiwan