Mems-Vorrichtung, Optische Gassensorvorrichtung, Herstellungsverfahren für Mems-Vorrichtung und Herstellungsverfahren für Optische Gassensorvorrichtung

Details

Veröffentlichungs-Nr.

EP4793627

Anmeldetag

17. Februar 2026

Veröffentlichung

19. August 2026

Rechtsraum

EP

IPC

G01N21/3504, B81B7/00

Abstract

A MEMS device, including: a MEMS element (2, 4) that has a space surrounded by an outer peripheral frame from four directions, has a thin film closing the space from an upper surface of the outer peripheral frame, and has an electrode pad (P1 to P4) for wire bonding on the outer peripheral frame; a mount (213) on which the MEMS element is mounted; and a plurality of adhesive areas (241 to 244) that bonds the MEMS element to the mount and are arranged on a plane of the mount. At least one of the plurality of adhesive areas is arranged at a position corresponding to the electrode pad in the plane.

Anmelder

Firma

Mitsumi Electric Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete