Trockenfilmfotoresist mit Lichtempfindlicher Harzzusammensetzung, Verfahren zur Herstellung Davon, Resiststruktur und Anzeigevorrichtung

Details

Veröffentlichungs-Nr.

EP4793705

Anmeldetag

29. Oktober 2024

Veröffentlichung

5. Juni 2025

Rechtsraum

EP

IPC

G03F7/004, G03F7/16, G03F7/20

Abstract

The present disclosure relates to a dry film photoresist comprising: a substrate film that does not have a separate release layer; and a photosensitive resin layer containing a cured product of a photosensitive resin composition comprising an epoxy binder, a surfactant, a cationic initiator, and a low boiling point solvent formed on the substrate film, wherein a thickness of the photosensitive resin layer is 100 µm or more, and wherein a resolution pitch (Line/Space) based on a 100 µm coating film of the photosensitive resin layer after exposure and development is 20 µm or less, and a method for preparing the same, and a resist pattern, and a display device using the same.

Anmelder

Firma

Kolon Industries, Inc.

Land

🇰🇷 Südkorea

Fachgebiete