Waferhaltesystem mit einem Waferhalter, Magnetronsputtergerät mit Diesem Waferhaltesystem und Verfahren zur Sputterabscheidung mittels Magnetronsputtern

Details

Veröffentlichungs-Nr.

EP4793986

Anmeldetag

14. Februar 2025

Veröffentlichung

19. August 2026

Rechtsraum

EP

Abstract

A method for sputter deposition using a magnetron sputter with a target, said method comprising the acts of: - establishing a vacuum zone in a vacuum chamber (110), and in the vacuum zone: - providing a wafer chuck (10) slidable arranged on at least one rail (30); - arranging a wafer (90) with a deposition surface (92) on the wafer chuck (10) with said deposition surface (92) facing the target; wherein the wafer chuck (10) is configured for rotating the wafer in a rotational plane (122) substantially parallel to the deposition surface (92) and wherein the method comprises an act of - sputtering target material onto the wafer (90) when arranged on the wafer chuck (10), while rotating the wafer and moving the wafer chuck (10) linearly back and forth along the rail (30) in a direction substantially parallel to the rotational plane.

Anmelder

Firma

Polyteknik A/S

Land

🇩🇰 Dänemark