Substrat mit Feinen Metallgefüllten Durchgangslöchern und Herstellungsverfahren dafür

Details

Veröffentlichungs-Nr.

EP4794459

Anmeldetag

12. Februar 2026

Veröffentlichung

19. August 2026

Rechtsraum

EP

Abstract

A substrate (10) having a plurality of fine through-holes (2) filled with metal (3), comprising a conductive layer (3a, 3b) formed on an inner wall surface of each through-hole (2) and a metal solder layer (3c) formed by solidification of a nickel-containing molten solder (5) that has been treated with an organic fatty acid-containing solution (21). The conductive layer includes a copper plating layer (3b) on the metal solder layer (3c) side. An intermetallic compound layer (4) that suppresses copper dissolution is formed at the interface between the copper plating layer (3b) and the metal solder layer (3c). The substrate (10) is preferably a glass or quartz substrate (1). Also provided is a manufacturing method thereof.

Anmelder

Firma

Tanigurogumi Corporation

Land

🇯🇵 Japan