Verpackung und Verfahren zur Herstellung der Verpackung
Anmelder: Sony Semiconductor Solutions Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4794483
- Anmeldetag
- 19. August 2024
- Veröffentlichung
- 17. April 2025
- Rechtsraum
- EP
Abstract
Packaging chips can be achieved while minimizing an increase in a mounting area. A package includes: a sensor chip that is face-down mounted; a semiconductor chip that is face-down mounted at a position different from the sensor chip; a sealing material that collectively seals the sensor chip and the semiconductor chip in such a way that a back surface side of the sensor chip is exposed; and a wiring layer that is formed on a mounting surface on which the sensor chip and the semiconductor chip are mounted. The sensor chip may be a back-side illumination image sensor. The package further includes an interposer substrate including the wiring layer, and the interposer substrate may include a through electrode connected to the wiring layer.
Anmelder
- Firma
- Sony Semiconductor Solutions Corporation
- Land
- 🇯🇵 Japan
Japanisches Halbleiterunternehmen mit Sitz in Atsugi, eine Tochtergesellschaft der Sony Group. Das Unternehmen entwickelt Bildsensoren, CMOS-Sensoren und Halbleiterlösungen für Kameras, Smartphones, Automobile und industrielle Anwendungen.
6.201 Patente in unserer Datenbank