Verfahren zur Erhöhung der Pin-Ausrichtungsgenauigkeit für ein Leistungshalbleitermodul

Details

Veröffentlichungs-Nr.

EP4794513

Anmeldetag

4. Februar 2026

Veröffentlichung

19. August 2026

Rechtsraum

EP

Abstract

A method for increasing overall pin alignment accuracy for a power semiconductor module having a plurality of pins includes attaching the plurality of pins and one or more power semiconductor dies to a first side of a substrate to form a power semiconductor subassembly; aligning a distal end of each of the pins with an alignment feature of an electrically insulative housing using a jig; and after the aligning, attaching the housing to the power semiconductor subassembly. The housing is attached to the subassembly such that the housing and the substrate together define an interior space in which the pins and the one or more power semiconductor dies are disposed. The pins jut out beyond the housing.

Anmelder

Firma

Infineon Technologies AG

Land

🇩🇪 Deutschland