Halbleiterchips mit Kühlkanälen

Details

Veröffentlichungs-Nr.

EP4797327

Anmeldetag

19. Februar 2025

Veröffentlichung

26. August 2026

Rechtsraum

EP

Abstract

Examples of the disclosure relate to semiconductor chips and methods of forming semiconductor chips. The chips comprise multiple integrated circuit layers arranged in a stack and a cooling channel positioned between integrated circuit layers. The cooling channel is bounded by at least two walls and configured to enable a cooling fluid to provide cooling of electronic and/or photonic components on the integrated circuit layers. The walls comprise a first bonding material arranged on a first edge of the walls, for bonding the first edges of the walls to the first integrated circuit layer. The walls also comprise a second bonding material arranged on a second edge of the walls, for bonding the second edges of the walls to the second integrated circuit layer.

Anmelder

Firma

Nokia Solutions and Networks Oy

Land

🇫🇮 Finnland