Kühlsystem für Elektronische Vorrichtungen

Details

Veröffentlichungs-Nr.

EP4801213

Anmeldetag

17. Februar 2026

Veröffentlichung

2. September 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

The present disclosure is generally related to a cooling system for an electronic device. Some electrical devices benefit from having foam inside an outer metal enclosure/chassis to hold the various components. The foam can assist with one or more of airflow, device mounting, noise dampening and shock absorption. However, one challenge that exists is that foam can present challenges for heat dissipation from the various electronic components. One exemplary aspect is directed to a fan-based cooling system for electronic devices that are mounted in a foam support structure. Another exemplary aspect is directed to a fan-based cooling system for electronic medical devices that are mounted in a foam support structure. Yet another exemplary aspect is directed to a fan-per-component group solution for cooling an electronic device.

Anmelder

Firma

Karl Storz SE & Co. KG

Land

🇩🇪 Deutschland

Fachgebiete