Gehäuse für Integrierte Schaltungsvorrichtung mit Pufferungsschicht

Details

Veröffentlichungs-Nr.

EP4801252

Anmeldetag

2. Februar 2026

Veröffentlichung

2. September 2026

Rechtsraum

EP

IPC

H10W70/60

Abstract

In an embodiment, a packaged integrated circuit device includes a package substrate. The package substrate may be flip-chip type package substrate. A layer is disposed on the package substrate. An interposer is disposed on the layer. This layer may have passthrough type through vias permitting electrical interconnections between the package substrate and the interposer. The interposer may have various wiring layers and circuit components therein. One or more dies are disposed on the interposer. A die may be an application specific integrated circuit devices, a high-speed memory device, or the like. The layer has a coefficient of thermal expansion that is between a coefficient of thermal expansion of the interposer and a coefficient of thermal expansion of the package substrate. The layer can function to intermediate stresses or strains arising during manufacturing and/or operation related to thermal expansion differences in components.

Anmelder

Firma

Avago Technologies International Sales Pte. Limited

Land

🇸🇬 Singapur

Fachgebiete