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EP4803302 8. Mai 2025

Anmelder: Mitsubishi Chemical Corporation 🇯🇵

Details

Veröffentlichungs-Nr.
EP4803302
Anmeldetag
30. Oktober 2024
Veröffentlichung
8. Mai 2025
Rechtsraum
EP
Offizieller Volltext

Abstract

Provided is a bonded body including an upper metal-containing member 2 and a lower metal-containing member 3 bonded, respectively, to upper and lower surfaces of a bonding sheet 1, which can suppress cracks and deformations in the bonding sheet 1 even when stress is applied to the bonding sheet 1 due to a difference in expansion coefficients between the members caused by temperature changes.The upper metal-containing member 2 and the lower metal-containing member 3 each have a metal portion in a bonding surface with the bonding sheet 1, the bonding sheet 1 is a cured product of a thermosetting resin composition containing a thermosetting resin and an inorganic filler, the entire upper surface of the bonding sheet 1 is bonded to the upper metal-containing member 2, the entire lower surface of the bonding sheet 1 is bonded to the lower metal-containing member 3, and when the bonding sheet 1 is viewed in cross-section, a value of P<sub>1A</sub>/P<sub>1B</sub> is more than 1.10, where P<sub>1A</sub> is a resin area ratio in an end region 1A extending 300 µm inward from either the left or right end of the bonding sheet 1, and P<sub>1B</sub> is a resin area ratio in a central region 1B other than the end region 1A.

Anmelder

Firma
Mitsubishi Chemical Corporation
Land
🇯🇵 Japan
🇯🇵 Mitsubishi Chemical

Japanisches Chemieunternehmen mit Sitz in Tokio, Teil der Mitsubishi-Chemical-Gruppe. Das Unternehmen entwickelt Grund- und Spezialchemikalien, Kunststoffe, Materialien für Elektronik und Energiespeicher sowie Pharma- und Life-Science-Produkte.

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