Anpassbare Sensoren und Verfahren zur Herstellung Anpassbarer Sensoren

Details

Veröffentlichungs-Nr.

EP4803897

Anmeldetag

5. März 2026

Veröffentlichung

9. September 2026

Rechtsraum

EP

Abstract

Provided herein are conformable sensor assemblies and methods for manufacturing conformable sensor assemblies. In some embodiments, a method of manufacturing a conformable sensor assembly (100A, 100B, 100C) includes printing a high-resolution sensor element (106, 204, 604) on a first layer (102, 102B, 206, 306) using at least one of an electrohydrodynamic inkjet or an ultra-high resolution micro-dispensing process. The first layer (102, 102B, 206, 306) comprises a flexible or a stretchable substrate. The method also includes printing a mid-resolution sensor element (116, 304) on a second sensor layer (206, 306) using at least one of an aerosol, inkjet jet, screen-printing, or copper etching process. The second sensor layer (206, 306) is made from a flexible or a stretchable substrate. The mid-resolution sensor element (116, 304) having a trace spacing (606) in the range of about 20 microns to about 100 microns. The high-resolution sensor element (106, 204, 604) has a trace spacing (606) of less than about 20 microns. The first layer (102, 102B, 206, 306) is coupled with the second sensor layer (206, 306) to form a sensor assembly (100A, 100B, 100C).

Anmelder

Firma

General Electric Company

Land

🇺🇸 USA