Elektronische Vorrichtung mit Verbessertem Leiterplattenhaltesystem

Details

Veröffentlichungs-Nr.

EP4803976

Anmeldetag

23. Februar 2026

Veröffentlichung

9. September 2026

Rechtsraum

EP

Abstract

The present disclosure is generally related to a device for holding a Printed Circuit Board (PCB) or similar electrical component. Some electrical devices benefit from having foam inside an outer metal enclosure to hold the various components. The foam can assist with one or more of airflow, device mounting, noise dampening and shock absorption. However, one challenge that exists, especially for high frequency electronic devices, is that the foam being in contact with the PCB can potentially cause electrical interference issues. As such, an exemplary embodiment is directed to an improved PCB securing structure. One exemplary aspect is directed to a PCB clip and support block that secure a PCB to and electrically isolate the PCB from the support block. Another exemplary aspect is directed to a monolithic PCB clip that secures a PCB to mounting foam within an enclosure and electrically isolates the PCB from the mounting foam.

Anmelder

Firma

Karl Storz SE & Co. KG

Land

🇩🇪 Deutschland