Herstellungsverfahren für auf Festkörpersekundärbatterie Montierte Leiterplatte

Details

Veröffentlichungs-Nr.

EP4804279

Anmeldetag

28. Oktober 2024

Veröffentlichung

8. Mai 2025

Rechtsraum

EP

Abstract

Provided is a method for manufacturing an all-solid-state secondary battery-mounted circuit board that can maintain good characteristics of the all-solid-state secondary battery. The method for manufacturing an all-solid-state secondary battery-mounted circuit board of the present invention is a method for manufacturing a circuit board on which an all-solid-state secondary battery is mounted, the all-solid-state secondary battery having a power generation element in which a positive electrode layer, a solid electrolyte layer, and a negative electrode layer are stacked in this order, and an exterior body accommodating the power generation element, the positive electrode layer including a sulfide-based solid electrolyte and a positive electrode active material on which a reaction suppressing layer is formed on at least a portion of a surface of the positive electrode active material, the method comprising a step of mounting the all-solid-state secondary battery on a circuit board through reflow soldering, wherein the all-solid-state secondary battery is subjected to the reflow soldering in a state in which a potential of the positive electrode layer is 2.55 V or less relative to the lithium potential.

Anmelder

Firma

Maxell, Ltd.

Land

🇯🇵 Japan