Wärmeableitungsmodul, Montageverfahren dafür und Elektronische Vorrichtung damit

Details

Veröffentlichungs-Nr.

EP4807791

Anmeldetag

6. Juni 2025

Veröffentlichung

16. September 2026

Rechtsraum

EP

IPC

H01L23/40, H01L21/48, H05K1/02

Abstract

This disclosure is directed to a heat dissipation module, an assembling method thereof and an electronic device having the same. The heat dissipation module is used for dissipating heat from a heat source (110) on a circuit board (100), the heat dissipation module has a fixing seat (200), a combination frame (300) and a heat dissipator (400). The fixing seat (200) is arranged on the circuit board (100) to locate the heat source (110) at or adjacent to a center of the fixing seat (200). The fixing seat (200) has a plurality of first latches (210). The combination frame (300) has a limiting structure (310) and a plurality of second latches (320). The second latches (320) are respectively snapped on the first latches (210) to fix the combination frame (300) on the fixing seat (200). The limiting structure (310) limits the heat dissipator (400) so that at least a portion of the heat dissipator (400) is limited in the combination frame (300) to attach the heat dissipator (400) to the heat source (110) along a vertical direction. Accordingly, the heat dissipator (400) may be quickly, stably and accurately installed on the circuit board (100) and sealed with the heat source (110). Moreover, the heat dissipator (400) is avoided from deformation caused by overload or uneven load during an installation process.

Anmelder

Firma

DELTA ELECTRONICS, INC.

Land

🇹🇼 Taiwan

Fachgebiete