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Details

Veröffentlichungs-Nr.

EP4808285

Anmeldetag

30. August 2024

Veröffentlichung

15. Mai 2025

Rechtsraum

EP

Abstract

Provided is a circuit board capable of performing connection of a conductive material to an additional metal layer by welding. The circuit board includes a circuit pattern 3 provided on an insulating layer 7, an additional metal layer 9 stacked and bonded on the circuit pattern 3, and a lead frame 11 stacked on the additional metal layer 9 and connected to the additional metal layer by welding, wherein a total thickness of the additional metal layer 9 and the circuit pattern 3 in the stacking direction is 1.5mm to 3.0mm, and a thickness of the lead frame 11 in the stacking direction is 0.2mm to 1.2mm.

Anmelder

Firma

NHK Spring Co., Ltd.

Land

🇯🇵 Japan