Verfahren zur Bereitstellung einer Mehrschichtigen Haftschicht auf einem Werkstück

Details

Veröffentlichungs-Nr.

EP4808308

Anmeldetag

30. Dezember 2025

Veröffentlichung

16. September 2026

Rechtsraum

EP

IPC

H10D64/01, H10D64/66

Abstract

According to the invention there is provided a method of providing a multilayer adhesion layer on a workpiece comprising a semiconductor substrate, the method comprising: providing a semiconductor substrate having a layer of polysilicon located thereon; depositing, on the layer of polysilicon, a first layer of titanium having a thickness in the range 5 nanometres to 10 nanometres; depositing, on the first layer of titanium, a layer of titanium nitride having a thickness in the range 10 nanometres to 25 nanometres; and depositing, on the layer of titanium nitride, a second layer of titanium having a thickness in the range 20 nanometres to 30 nanometres.

Anmelder

Firma

SPTS Technologies Limited

Land

🇬🇧 Großbritannien

Fachgebiete