Gestapelte Back-To-Back-Leistungsmodule und Verfahren zur Herstellung

Details

Veröffentlichungs-Nr.

EP4808341

Anmeldetag

12. März 2026

Veröffentlichung

16. September 2026

Rechtsraum

EP

Abstract

An electronic component (100) includes a first subassembly (102) and a second subassembly (130). The first subassembly (102) includes a first power overlay (POL) (104) that provides electrical connections to at least one semiconductor device (112) included in the first subassembly (102). The second subassembly (130) includes a second POL (132) that provides electrical connections to at least one semiconductor device (140) included in the second subassembly (130). The second subassembly (130) is disposed over the first subassembly (102) with the second POL (132) oriented toward the first POL (104) and with electrical connections between the first and second subassemblies (102)(130) that form a power module.

Anmelder

Firma

General Electric Company

Land

🇺🇸 USA