Kupferlegierung, Kupferlegierungskunststoffverarbeitungsmaterial, Komponente für Elektronische/elektrische Vorrichtung, Komponente für Flexible Vorrichtung, Komponente zur Wärmeableitung und Metalldichtungsmaterial

Details

Veröffentlichungs-Nr.

EP4810633

Anmeldetag

6. November 2024

Veröffentlichung

22. Mai 2025

Rechtsraum

EP

Abstract

A copper alloy has a composition containing 15% by mass or more and 57% by mass or less of Zn and containing 12% by mass or less of Al, in which, when a contained amount of Zn is denoted by A% by mass and a contained amount of Al is denoted by B% by mass, A + 5 × B ≥ 30 and A + 3.5 × B ≤ 57 are satisfied, and a balance is Cu and inevitable impurities, in which a volume fraction of a β phase is 50% or more, and when measurement is performed by an EBSD method on a measurement area of 1 mm<2> or more at a step size of 1 µm, an average value of Kernel Average Misorientation (KAM) values of the β phase, which is measured by excluding measurement points for which a CI value analyzed by data analysis software OIM is 0.1 or less, is 2.0° or less, where the copper alloy has excellent conductive properties, has a low Young's modulus and a sufficiently large elastic deformation amount, and is unlikely to undergo plastic deformation even in a case of receiving large deformation.

Anmelder

Firmen

Mitsubishi Materials Corporation
Tohoku University

Land

🇯🇵 Japan