Kupferlegierung, Kupferlegierungskunststoffverarbeitungsmaterial, Komponente für Elektronische und Elektrische Ausrüstung, Komponente für Flexible Vorrichtung, Wärmeableitungskomponente und Metalldichtungsmaterial

Details

Veröffentlichungs-Nr.

EP4810634

Anmeldetag

6. November 2024

Veröffentlichung

22. Mai 2025

Rechtsraum

EP

Abstract

A copper alloy has a composition containing 15% by mass or more and 57% by mass or less of Zn and containing 12% by mass or less of Al, in which, when a contained amount of Zn is denoted by A% by mass and a contained amount of Al is denoted by B% by mass, A + 5 × B ≥ 30 and A + 3.5 × B ≤ 57 are satisfied, and a balance is Cu and inevitable impurities, in which a volume fraction of a β phase is 50% or more, and when measurement is performed by an EBSD method on a measurement area of 8 mm<2> or more at a step size of 8 µm, and measurement points are analyzed by data analysis software OIM, excluding measurement points having a CI value of 0.1 or less, a crystal grain boundary is defined between adjacent measurement points with a misorientation of 5° or more, and a proportion of coincidence site lattice grain boundary length of 3 < Σ ≤ 29 to a total length of all crystal grain boundaries at which measured β phases are in contact with each other is 4% or more, where the copper alloy has excellent conductive properties, has a low Young's modulus and a sufficiently large elastic deformation amount, and is unlikely to undergo plastic deformation even in a case of receiving large deformation.

Anmelder

Firmen

Mitsubishi Materials Corporation
Tohoku University

Land

🇯🇵 Japan