Kühlkörper zur Kühlung eines Elektronischen Chips mit Flüssigkeitskühlung

Details

Veröffentlichungs-Nr.

EP4811429

Anmeldetag

21. März 2025

Veröffentlichung

23. September 2026

Rechtsraum

EP

IPC

H01L23/367, H01L23/473

Abstract

The invention relates to a liquid cooling heatsink (1) for cooling a microprocessor (3) mounted on a printed circuit board (4) of a computing device (2), said liquid cooling heatsink (1) comprising a body (10) and a thermal interface pad (20), said body (10) comprising a heat face (10-1), a mounting face (10-2), a parallelepipedal internal cavity delimited inside the body (10), a cooling liquid inlet (120), a cooling liquid channel, a heated liquid channel, a heated liquid outlet and a plurality of parallel fins mounted in the parallelepipedal internal cavity orthogonally to said thermal interface pad and along a direction extending between a first lateral face and a second lateral face of the parallelepipedal internal cavity to allow the cooling liquid to flow between said fins.

Anmelder

Firma

BULL SAS

Land

🇫🇷 Frankreich

Fachgebiete