Dichtungsanordnung, Elektrische Verbindungsanordnung und Verbinder
Anmelder: Tyco Electronics (Shanghai) Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4811562
- Anmeldetag
- 10. März 2026
- Veröffentlichung
- 23. September 2026
- Rechtsraum
- EP
- IPC
- H01R13/52
Abstract
The present invention discloses a sealing assembly, an electrical connection assembly, and a connector. The sealing assembly comprises: a pair of half shells (20) that are adapted to be detachably fastened together, and each has axially opposite front wall (21) and rear wall (22), and a peripheral wall (23) located between the front wall (21) and the rear wall (22); and the pair of gel blocks (1) which are respectively received in the pair of half shells (20). A notch (231) is formed on the splicing part (230) of the peripheral wall (23) of the half shell (20), the gel block (1) comprises a block body (10) and a convex part (11) on one side of the block body (10), the block body (10) is contained in the inner cavity of the half shell (20), and the convex part (11) is contained in the notch (231) of the half shell (20), the block bodies (10) of the pair of gel blocks (1) are used for clamping a flexible flat piece (4) and is suitable for being clamped between the pair of half shells (20) to realize the sealing between the flexible flat piece (4) and the pair of half shells (20); the convex parts (11) of the pair of gel blocks (1) are suitable to be clamped between the splicing parts (230) of the peripheral walls (23) of the pair of half shells (20), and are used to seal a gap (20a) between the splicing parts (230) of the peripheral walls (23) of the pair of half shells (20). The present invention not only has low cost, but also is easy to assemble and has great market competitiveness.
Anmelder
- Firma
- Tyco Electronics (Shanghai) Co., Ltd.
- Land
- 🇨🇳 China
Der Anmelder ist eine chinesische Gesellschaft aus dem Tyco-Electronics-Konzern, der Vorläuferorganisation des heutigen TE-Connectivity-Konzerns, mit Fertigungs- und Entwicklungsstandort in Shanghai. Das Patentportfolio konzentriert sich stark auf Halbleiter- und Elektrobauelemente, ergänzt durch Optik und elektrische Energietechnik. Anmeldungen laufen seit 2009 durchgehend fort.
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