Leistungsmodul und Stromversorgungsvorrichtung
Anmelder: HUAWEI TECHNOLOGIES CO., LTD. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4811661
- Anmeldetag
- 18. März 2026
- Veröffentlichung
- 23. September 2026
- Rechtsraum
- EP
- IPC
- H03K17/0812
Abstract
Embodiments of this application provide a power module and a power supply device. The power module includes a half-bridge circuit and a driver. The half-bridge circuit includes two serially connected power transistors, and the two power transistors do not share a ground. The driver includes two drive parts. One of the drive parts is configured to drive one of the power transistors, and a circuit in which the one drive part is located shares a ground with the one corresponding power transistor. The power module further includes two first resistors connected in series and a power supply, and each drive part includes a power input end, a high-voltage signal transmission end, and a voltage output end. One end of the power supply is connected to the high-voltage signal transmission end by using the power input end, the other end of the power supply is grounded, the high-voltage signal transmission end is further grounded by using the two first resistors connected in series, and a voltage of the high-voltage signal transmission end is used to drive one of the power transistors to be turned on. The voltage output end is connected to a connection point between the two first resistors connected in series, and the voltage output end is configured to output a voltage to the connection point.
Anmelder
- Firma
- HUAWEI TECHNOLOGIES CO., LTD.
- Land
- 🇨🇳 China
Chinesisches Technologieunternehmen mit Sitz in Shenzhen. Entwickelt Telekommunikationsinfrastruktur, Netzwerktechnik, Smartphones und weitere Unterhaltungs- und Kommunikationselektronik.
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