Verfahren zum Schrumpfen des Speichersignals in Bezug auf das Balllayout
Anmelder: Realtek Semiconductor Corp. 🇹🇼
Details
- Veröffentlichungs-Nr.
- EP4811935
- Anmeldetag
- 4. März 2026
- Veröffentlichung
- 23. September 2026
- Rechtsraum
- EP
Abstract
A method for shrinking a memory signal via region in accordance with memory-side ball layout to adjust control-side ball arrangement for installing a control circuit at a printed circuit board (PCB) and associated apparatus are provided. The method may include: providing a set of pads on a board-side region of a package of the control circuit, the set of pads corresponding to a set of first pads within a first installation region of the PCB, to act as control-side memory signal pads for conducting a set of predetermined memory signals (S11); and providing multiple other pads on the board-side region, the multiple other pads corresponding to a set of remaining pads within the first installation region, to act as other-purpose pads for conducting other signals, where multiple vias are arranged as being adjacent to the first pads to shrink the memory signal via region, for enhancing control-side ball-arrangement flexibility (S12).
Anmelder
- Firma
- Realtek Semiconductor Corp.
- Land
- 🇹🇼 Taiwan
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