Leiterplatte und Verfahren zur Herstellung einer Leiterplatte

Details

Veröffentlichungs-Nr.

EP4811936

Anmeldetag

7. November 2024

Veröffentlichung

30. Mai 2025

Rechtsraum

EP

Abstract

A circuit board includes a base material, at least a pair of terminals provided on the base material; a bonding material disposed on the terminals and containing a metal element; and an inner wall of an insulating material rising from the base material in a height direction orthogonal to a main surface of the base material. The pair of terminals and the bonding material are disposed in a cavity formed in the wall, at least one groove portion penetrating an outer peripheral surface from an inner peripheral surface is formed in the inner wall, and an outer wall of an insulating material rising from the base material in the height direction is provided on an outer peripheral side of the inner wall so as to surround the cavity.

Anmelder

Firma

TDK Corporation

Land

🇯🇵 Japan