Leiterplatte und Verfahren zur Herstellung einer Leiterplatte

Details

Veröffentlichungs-Nr.

EP4811937

Anmeldetag

7. November 2024

Veröffentlichung

30. Mai 2025

Rechtsraum

EP

Abstract

A circuit board includes a base material having a main surface, a first terminal and a second terminal provided on the main surface of the base material, and one or more walls of an insulating material provided on the main surface of the base material, wherein the first and second terminals are arranged in a cavity surrounded by the wall, and at least one of corner portions formed from two wall frame portions among the walls has a groove portion penetrating from an inner peripheral surface to an outer peripheral surface.

Anmelder

Firma

TDK Corporation

Land

🇯🇵 Japan