Massgeschneiderte Hf-Induktoren für Hf-Module

Details

Veröffentlichungs-Nr.

EP4812006

Anmeldetag

13. März 2026

Veröffentlichung

23. September 2026

Rechtsraum

EP

IPC

H10W44/00, H01F5/00

Abstract

Disclosed herein are embodiments of a radio frequency (RF) package that include a package laminate and a surface mount device mounted to a mounting surface of the package laminate. The package laminate includes a first laminate substrate and a metallic structure integrated with the first laminate substrate. An electronic component is mounted to the mounting surface of the first laminate substrate. The surface mount device includes a second laminate substrate and an inductor integrated with the second laminate substrate. A bounded physical area is defined by at least one of a surface of the electronic component and the metallic structure that defines a boundary of the bounded physical area. The surface mount device is dimensioned so as to fit within the bounded physical area. In this manner, the surface mount device allows for a more compact RF package with a higher quality factor.

Anmelder

Firma

Qorvo US, Inc.

Land

🇺🇸 USA

Fachgebiete