Leistungshalbleitermodul und Montageverfahren

Details

Veröffentlichungs-Nr.

EP4815036

Anmeldetag

25. März 2025

Veröffentlichung

30. September 2026

Rechtsraum

EP

IPC

H01L25/07, // H01L23/36

Abstract

The invention relates to a power semiconductor module (1) and a method to assemble the module. The module comprises an electrically conducting base plate (110) and an electrically conducting top plate (120) arranged parallel, a plurality of power semiconductor devices (100) arranged on the base plate (110) facing the top plate (120), a plurality of electrical contacts (130) electrically connecting the plurality of semiconductor devices (100) in parallel, and a flat plate structure (140) mechanically and/or electrically interconnecting the electrical contacts (130), wherein each of the electrical contacts (130) comprises a presspin body (131) with a pin foot (1312) having a top surface (13121) abutting the flat plate structure (140) and a bottom surface (13122) facing the base plate (110), the top surface (13121) and/or the bottom surface (13122) of each pin foot (1312) has a convex spherical cap shape.

Anmelder

Firma

Hitachi Energy Ltd

Land

🇨🇭 Schweiz

Fachgebiete