Inspektionssystem, Inspektionsverfahren und Schalenstruktur
Anmelder: Tokyo Electron Limited 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4822739
- Anmeldetag
- 25. November 2024
- Veröffentlichung
- 12. Juni 2025
- Rechtsraum
- EP
- IPC
- H01L21/66
Abstract
An inspection system includes: a joining device configured to join a substrate and a jig in a state in which a conductive part of the substrate and a contact part of the jig are brought into a contacted and conductive state, to form a shell structure from which an electrode of the jig is exposed; a conveying module connected to the joining device and configured to convey the shell structure formed by the joining device; a determination unit configured to determine whether a joining state of the shell structure formed by the joining device is normal or abnormal; and an inspection device connected to the conveying module and configured to inspect the substrate via the electrode of the jig of the shell structure determined to be normal by the determination unit.
Anmelder
- Firma
- Tokyo Electron Limited
- Land
- 🇯🇵 Japan
Japanisches Technologieunternehmen mit Sitz in Tokio, einer der weltweit größten Hersteller von Halbleiterfertigungsanlagen. Aktiv in Beschichtungs-, Ätz- und Reinigungssystemen für die Chip- und Displayproduktion.
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Hoffmann Eitle
Hoffmann Eitle · München