Wärmeverwaltungssystem für Elektronikgehäuse

Details

Veröffentlichungs-Nr.

EP4823259

Anmeldetag

2. März 2026

Veröffentlichung

14. Oktober 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

The present disclosure relates to a hybrid cooling system for electronic enclosures that can incorporate both liquid and air-based cooling mechanisms within a single structure. The system can include a thermal transfer assembly that facilitates heat transfer between liquid-cooled and aircooled components, allowing for efficient thermal regulation across multiple heat-generating components with different cooling requirements. The thermal transfer assembly can include a thermally conductive plate, which can be fluidly associated with a coolant medium, and a set of heat-absorbing elements that can extend into an enclosed volume. The system can be configured to dissipate heat from a first heat-generating component through direct thermal coupling with the thermally conductive plate while transferring heat from a second heat-generating component positioned within the enclosed volume.

Anmelder

Firma

Eaton Intelligent Power Limited

Land

🇮🇪 Irland

Fachgebiete