Elektronische Leiterplatte und Tauchkühlvorrichtung dafür

Details

Veröffentlichungs-Nr.

EP4823263

Anmeldetag

7. April 2026

Veröffentlichung

14. Oktober 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

An immersion cooling apparatus (100) according to an embodiment of the present disclosure includes a housing (110) configured to store a cooling fluid (10) therein; a plurality of electronic circuit boards (120) disposed inside the housing (110) to be immersed in the cooling fluid (10); and a heat exchange device (130) configured to perform heat exchange with the cooling fluid (10) having absorbed heat from the plurality of electronic circuit boards (120). At least one of the plurality of electronic circuit boards (120) includes a substrate (121); a plurality of electronic components (122) disposed on the substrate (121); and at least one coalescing unit (123) disposed between the plurality of electronic components (122), the at least one coalescing unit (123) being configured to coalesce at least one first vapor bubble (21) that is generated by heat of an electronic component (122) located at a lower position among the plurality of electronic components (122) and rises in an vertical direction of the housing (110).

Anmelder

Firma

SK Innovation Co., Ltd.

Land

🇰🇷 Südkorea

Fachgebiete