Lichtquellenvorrichtung

Details

Veröffentlichungs-Nr.

EP4823288

Anmeldetag

29. Oktober 2024

Veröffentlichung

10. Juli 2025

Rechtsraum

EP

IPC

H10H20/853, H10H20/857

Abstract

A light source device comprising: an LED substrate including, on a main surface, a first conductive layer and a second conductive layer that are each formed of a metal material and provided adjacent to each other; an LED element placed on the second conductive layer and including a first electrode provided on a light-emitting surface and a second electrode provided on a surface opposite to the light-emitting surface; a wire connecting the first electrode of the LED element and the first conductive layer; a metal bonding layer formed on the second conductive layer between the LED element and the second conductive layer and containing at least silver; and a resin layer formed along a periphery of the LED element and covering a surface of the metal bonding layer, wherein, in a direction in which the wire extends, the resin layer is formed in a narrow path along a side surface of the LED element between the LED element and an end portion of the second conductive layer, or between the LED element and a partition portion provided on the second conductive layer.

Anmelder

Firma

USHIO DENKI KABUSHIKI KAISHA

Land

🇯🇵 Japan

Fachgebiete