Kupplungsmechanismus für einen auf einer Leiterplatte montierten, resonanten Mikrowellen-Wiedereintrittshohlraum

Details

Veröffentlichungs-Nr.

EP2403053

Aktenzeichen

EP10305699

Anmeldetag

29. Juni 2010

Veröffentlichung

12. November 2014

Erteilung

12. November 2014

Rechtsraum

EP

IPC

H01P1/205H01P1/208

Abstract

A coupling mechanism to feed microwave signals to a 3-D PCB mounted resonant cavity. The microwave signals are coupled from a transmission line (61) embedded in a Printed Circuit Board PCB (67) to a resonant cavity (60) mounted on an external metalized surface (73) of this PCB. The coupling mechanism implements an easy-to-fabricate mechanism leading to high-quality filtering owing to the fact that the end of the transmission line is provided with a metalized feeding pad (63/71) located at the external layer of the PCB inside the resonant cavity. The resonant cavity is provided with a re-entrant inner stub (64) orthogonal to the PCB and separated from the PCB by a capacitive gap (66). The metalized feeding pad (63) is facing the inner stub in the area of the capacitive gap and is offset from the axial direction of this inner stub. The metalized feeding pad (63, 71) is further separated from the external metalized surface of the PCB by a surface capacitive gap (74).

Anmelder

Firmen

ALCATEL LUCENT
Alcatel Lucent

Land

🇫🇷 Frankreich

Fachgebiete