MEMS-Mikrofon
Anmelder: NXP B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP2420470
- Aktenzeichen
- EP10173323
- Anmeldetag
- 18. August 2010
- Veröffentlichung
- 14. Oktober 2015
- Erteilung
- 14. Oktober 2015
- Rechtsraum
- EP
- IPC
- B81B7/00
Abstract
A MEMS microphone comprises a support surface (106), a microphone substrate (201,202) over the support surface (106) and an assembly of a microphone membrane (103) and spaced back electrode (105) supported over the substrate. The substrate has an opening beneath the assembly. The interface between the support surface (106) and the substrate (201,202) comprises a plurality of discrete spaced portions (201 ) This structure provides some resilience to differential expansion and contraction that can arise during processing. The support surface can then be a different material to the substrate, for example a PCB laminate as the support surface and silicon as the substrate.
Anmelder
- Firma
- NXP B.V.
- Land
- 🇳🇱 Niederlande
Niederländischer Halbleiterhersteller mit Sitz in Eindhoven. Entwickelt Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation, Sicherheit sowie industrielle Anwendungen.
7.992 Patente in unserer Datenbank
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Crawford, Andrew
NoneNijmegen
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Williamson, Paul Lewis
NoneEindhoven