Gestapelte Halbbrückenverpackung mit gängigem leitfähigem Leitungsrahmen

Details

Veröffentlichungs-Nr.

EP2477221

Aktenzeichen

EP11191634

Anmeldetag

1. Dezember 2011

Veröffentlichung

22. Juni 2016

Erteilung

22. Juni 2016

Rechtsraum

EP

IPC

H01L23/495

Abstract

According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input, a control source coupled to an output terminal, and a control gate for being driven by a driver IC. The stacked half-bridge package further includes a sync transistor having a sync drain for connection to the output terminal, a sync source coupled to a low voltage input, and a sync gate for being driven by the driver IC. The control and sync transistors are stacked on opposite sides of a common conductive leadframe with the common conductive leadframe electrically and mechanically coupling the control source with the sync drain. The common conductive leadframe thereby serves as the output terminal.

Anmelder

Firma

International Rectifier Corporation

Land

🇺🇸 USA

Fachgebiete