Verfahren zum Schneiden eines Werkstücks mit einer Drahtsäge

EP2508317 Art B1 2. April 2014

Anmelder: Siltronic AG 🇩🇪

Details

Veröffentlichungs-Nr.
EP2508317
Aktenzeichen
EP12154161
Anmeldetag
7. Februar 2012
Veröffentlichung
2. April 2014
Erteilung
2. April 2014
Rechtsraum
EP
IPC
B28D5/00
Offizieller Volltext

Abstract

Provision of a method for cutting a workpiece with a wire saw whereby a large-diameter workpiece can be cut accurately and efficiently without any defects such as breakage occurring. When cutting a workpiece, a saw wire 1 is positioned so that at entry/exit points A which are the two ends of an meshing area M, the saw wire 1 is located above the surface of an abrasive grain slurry 6, and is not immersed into the abrasive grain slurry 6. Furthermore, the saw wire 1 and a workpiece W are immersed into the abrasive grain slurry 6 so that the surface of the abrasive grain slurry 6 is located between the entry/exit points A of the saw wire and a maximum bending point B where the saw wire 1 is bent most in the direction in which the workpiece is pushed. Moreover, all nozzles 4r and 4l are positioned in a manner that sprayed-on points P to which the abrasive grain slurry 6 is supplied, are located on the outside of the entry/exit points A of the saw wire 1.

Anmelder

Firma
Siltronic AG
Land
🇩🇪 Deutschland
🇩🇪 Siltronic

Deutscher Halbleiterzulieferer mit Sitz in München. Siltronic stellt hochreine Siliziumwafer für die Chip- und Elektronikindustrie her.

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