Verfahren zum Schneiden eines Werkstücks mit einer Drahtsäge
Anmelder: Siltronic AG 🇩🇪
Details
- Veröffentlichungs-Nr.
- EP2508317
- Aktenzeichen
- EP12154161
- Anmeldetag
- 7. Februar 2012
- Veröffentlichung
- 2. April 2014
- Erteilung
- 2. April 2014
- Rechtsraum
- EP
- IPC
- B28D5/00
Abstract
Provision of a method for cutting a workpiece with a wire saw whereby a large-diameter workpiece can be cut accurately and efficiently without any defects such as breakage occurring. When cutting a workpiece, a saw wire 1 is positioned so that at entry/exit points A which are the two ends of an meshing area M, the saw wire 1 is located above the surface of an abrasive grain slurry 6, and is not immersed into the abrasive grain slurry 6. Furthermore, the saw wire 1 and a workpiece W are immersed into the abrasive grain slurry 6 so that the surface of the abrasive grain slurry 6 is located between the entry/exit points A of the saw wire and a maximum bending point B where the saw wire 1 is bent most in the direction in which the workpiece is pushed. Moreover, all nozzles 4r and 4l are positioned in a manner that sprayed-on points P to which the abrasive grain slurry 6 is supplied, are located on the outside of the entry/exit points A of the saw wire 1.
Anmelder
- Firma
- Siltronic AG
- Land
- 🇩🇪 Deutschland
Deutscher Halbleiterzulieferer mit Sitz in München. Siltronic stellt hochreine Siliziumwafer für die Chip- und Elektronikindustrie her.
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