Druck-/Temperaturkombination in einer kompakten Sensoranordnung

Details

Veröffentlichungs-Nr.

EP2559987

Aktenzeichen

EP12180795

Anmeldetag

17. August 2012

Veröffentlichung

13. April 2022

Erteilung

13. April 2022

Rechtsraum

EP

IPC

G01L9/00G01L19/00G01L19/14G01D11/24

Abstract

A sensor assembly includes a rectangular-shaped pressure sensor element and an electronic circuitry coupled to receive a signal from the pressure sensor element. An open-ended fluid-tight passageway of the sensor assembly conveys fluid from a portal opening of the sensor assembly to a surface of the rectangular-shaped pressure sensor element. The sensor assembly further includes a closed-ended fluid-tight passageway, at least a portion of which is fabricated from metal. The closed-ended fluid tight passageway extends from at least from the portal opening of the sensor assembly to the electronic circuitry on at least a portion of a path adjacent to the rectangular-shaped ceramic pressure sensor element. The sensor assembly includes a temperature sensor element disposed in an end of the closed-ended fluid-tight passageway. Conductive links disposed in the closed-ended fluid tight passageway electrically couple the temperature sensor element to the electronic circuitry.

Anmelder

Firma

Sensata Technologies, Inc.

Land

🇺🇸 USA

Fachgebiete