Lichtemittierende Vorrichtung und lichtemittierende Vorrichtungsverpackung
Anmelder: LG Innotek Co., Ltd. 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP2562814
- Aktenzeichen
- EP12151048
- Anmeldetag
- 13. Januar 2012
- Veröffentlichung
- 19. August 2020
- Erteilung
- 19. August 2020
- Rechtsraum
- EP
- IPC
- H01L27/15// H01L33/00H01L33/62H01L33/32H01L33/22H01L33/38
Abstract
Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a support substrate, a first light emitting structure provided on the support substrate and comprising a first conductive type first semiconductor layer, a first active layer under the first conductive type first semiconductor layer, and a second conductive type second semiconductor layer under the first active layer, a first metal layer under the first light emitting structure, a second light emitting structure provided on the support substrate and comprising a first conductive type third semiconductor layer, a second active layer under the first conductive type third semiconductor layer, and a second conductive type fourth semiconductor layer under the second active layer, a second metal layer under the second light emitting structure, and a contact part making contact with a lateral side of the first conductive type first semiconductor layer and electrically connected to the second metal layer.
Anmelder
- Firma
- LG Innotek Co., Ltd.
- Land
- 🇰🇷 Südkorea
Südkoreanisches Elektronikunternehmen mit Sitz in Seoul, Tochtergesellschaft der LG-Gruppe. Entwickelt Komponenten für Kamera- und Optikmodule, Halbleiterträger, Motoren und Materialien für Mobilgeräte, Fahrzeuge und Displays.
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