Kupferbasierte Metallverdrahtung mit einer Oxidschicht, die Indium und Zink enthält

Details

Veröffentlichungs-Nr.

EP2717315

Aktenzeichen

EP13166248

Anmeldetag

2. Mai 2013

Veröffentlichung

2. Januar 2019

Erteilung

2. Januar 2019

Rechtsraum

EP

IPC

H01L29/786H05K1/09H05K3/06H01L29/45H01L27/12H01L29/49

Abstract

A wet etching composition usable for etching a copper-based wiring layer includes between about 40% by weight to about 60% by weight of phosphoric acid, between about 1% by weight to about 10% by weight of nitric acid, between about 3% by weight to about 15% by weight of acetic acid, between about 0.01% by weight to about 0.1% by weight of a copper-ion compound, between about 1% by weight to about 10% by weight of a nitric salt, between about 1% by weight to about 10% by weight of an acetic salt, and a remainder of water

Anmelder

Firma

Samsung Display Co., Ltd.

Land

🇰🇷 Südkorea

Fachgebiete