Biosensormodul mit einer biokompatiblen Elektrode

Details

Veröffentlichungs-Nr.

EP2738551

Aktenzeichen

EP12195328

Anmeldetag

3. Dezember 2012

Veröffentlichung

18. März 2015

Erteilung

18. März 2015

Rechtsraum

EP

IPC

G01N27/327

Abstract

There is described a method of manufacturing a module (200) for a biosensor. The described method comprises (a) providing a substrate (201), the substrate (201) comprising a trench (212) and a bond pad (214), wherein the trench (212) is filled with an electrically conductive material (219) and the bond pad (214) is arranged within the substrate (201), (b) removing a part of the electrically conductive material (219) from the trench (212) such that a recess (218) is formed in a surface of the substrate (201), (c) forming a biocompatible electrode (230) in the recess (218), and (d) removing a part of the substrate (201) such that the bond pad (214) is accessible through the surface of the substrate (201). There is also described a biosensor module manufactured in accordance with the above described method, as well as a biosensor comprising such a module. Furthermore, there is described a computer program and a corresponding computer program product for performing the described manufacturing method by means of a computer.

Anmelder

Firma

NXP B.V.

Land

🇳🇱 Niederlande

Fachgebiete