Lichtemittierendes Vorrichtungsgehäuse

Details

Veröffentlichungs-Nr.

EP2744001

Aktenzeichen

EP13197210

Anmeldetag

13. Dezember 2013

Veröffentlichung

10. Dezember 2014

Rechtsraum

EP

IPC

H01L23/49H01L23/498H01L33/62

Abstract

Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction.

Anmelder

Firmen

Suzhou Lekin Semiconductor Co., Ltd.
LG Innotek Co., Ltd.

Land

🇨🇳 China

Fachgebiete