Wabenstruktur und Herstellungsverfahren dafür

Details

Veröffentlichungs-Nr.

EP2784050

Aktenzeichen

EP14161129

Anmeldetag

21. März 2014

Veröffentlichung

22. August 2018

Erteilung

22. August 2018

Rechtsraum

EP

IPC

C04B37/00C04B38/00B01D46/24F01N3/20// C04B35/573C04B35/565

Abstract

There is disclosed a honeycomb structure capable of using as a catalyst carrier and also suitably functions as a heater by applying a voltage, and where a bonding layer to bond honeycomb segments together is hard to break and an electrical resistance value is hard to rise. The honeycomb structure includes a honeycomb segment bonded body 4 in which a plurality of honeycomb segments 6 are bonded together by a bonding layer 7, and a pair of electrode members 21 disposed on a side surface 5 of the honeycomb segment bonded body 4, each of the pair of electrode members 21 is formed into a band shape extending in an extending direction of cells 2 of the honeycomb segments 6, and in a cross section perpendicular to the extending direction of the cells 2, one electrode member 21 is disposed on an opposite side across the center of the honeycomb segment bonded body 4 to another electrode member 21, and in at least a part of the bonding layer 7, inorganic fibers made of β-SiC and a metal silicide are included in a porous body where particles of silicon carbide are bound with silicon as a binding material in a state where pores are held among the particles.

Anmelder

Firma

NGK Insulators, Ltd.

Land

🇯🇵 Japan

Fachgebiete