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Anmelder: Sensata Technologies, Inc., Sensata Technologies Massachusetts, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP2846415
- Aktenzeichen
- EP14183464
- Anmeldetag
- 3. September 2014
- Veröffentlichung
- 18. Juli 2018
- Erteilung
- 18. Juli 2018
- Rechtsraum
- EP
- IPC
- H01R13/24// H01R12/58
Abstract
In an embodiment, a stepped spring contact may have a first portion, a transition portion, and a second portion. The first portion may include a plurality of windings whose pitch may vary. The second portion may include a plurality of windings that are closely wound. A pitch of the windings contained in the second portion may be, for example, constant. The transition portion may include a winding that may make mechanical and electrical contact with a first electrical conductor (e.g., a pad contained on a printed circuit board (PCB)). The first portion may include a tip. The tip may be, for example, flat shaped or conically shaped. The tip may make electrical contact with a second electrical conductor (e.g., a terminal connector). In operation, the stepped spring contact may provide electrical continuity between the first electrical conductor and the second electrical conductor.
Anmelder
- Firmen
- Sensata Technologies, Inc.
Sensata Technologies Massachusetts, Inc. - Land
- 🇺🇸 USA
Sensata Technologies ist ein US-amerikanischer Hersteller von Sensoren und elektromechanischen Bauteilen, unter anderem für die Automobilindustrie. Das Patentportfolio konzentriert sich auf Mess- und Prüftechnik sowie Halbleiterbauelemente, ergänzt durch Fahrzeugtechnik. Die Titel betreffen unter anderem Schaltgeräte und Kontaktoren.
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