Vorreinigung einer Halbleiterstruktur

Details

Veröffentlichungs-Nr.

EP2849209

Aktenzeichen

EP14184760

Anmeldetag

15. September 2014

Veröffentlichung

4. November 2020

Erteilung

4. November 2020

Rechtsraum

EP

IPC

H01L21/02H01L21/768H01L21/311

Abstract

The invention relates to a method of pre-cleaning a semiconductor structure and to associated modular semiconductor process tools. The method includes the steps of: (i) providing a semiconductor structure having an exposed dielectric layer of an organic dielectric material, wherein the dielectric layer has one or more features formed therein which expose one or more electrically conductive structures to be pre-cleaned, in which the electrically conductive structures each include a metal layer, optionally with a barrier layer formed thereon, and the surface area of the exposed dielectric layer is greater than the surface area of the electrically conductive structures exposed by the dielectric layer; and (ii) pre-cleaning the semiconductor structure by performing an Ar/H2 sputter etch to remove material from the exposed electrically conductive structures and to remove organic dielectric material from the exposed dielectric layer.

Anmelder

Firma

SPTS Technologies Limited

Land

🇬🇧 Großbritannien

Fachgebiete