Verbindungsverfahren und Verfahren zur Herstellung einer Mikrokanalvorrichtung

Details

Veröffentlichungs-Nr.

EP2889121

Aktenzeichen

EP14199585

Anmeldetag

22. Dezember 2014

Veröffentlichung

30. September 2020

Erteilung

30. September 2020

Rechtsraum

EP

IPC

B29C65/08B81C3/00// B01L3/00

Abstract

A bonding method includes ultrasonically welding a protruding portion (17) extending on a surface of a first substrate member (10) to a surface of a second substrate member (11) by applying ultrasonic vibration to the first substrate member (10). A protruding stopper portion (18) for stopping welding is provided on the surface of the first substrate member (10) formed with the protruding portion (17), or on the surface of the second substrate (11) member to come in contact with the protruding portion (17) in a pressed state, to be disposed around the protruding portion (17) in the pressed state. The ultrasonically welding includes a first process for applying ultrasonic vibration at amplitude as a first value to the first substrate member, and a second process for applying ultrasonic vibration to the first substrate member at amplitude as a second value lower than the first value after the first process.

Anmelder

Firmen

FUJIFILM Corporation
Fujifilm Corporation

Land

🇯🇵 Japan

Fachgebiete