Halbleitervorrichtung mit transparentem Fenster, um Strahlung hindurchzulassen

Details

Veröffentlichungs-Nr.

EP2916357

Aktenzeichen

EP15157383

Anmeldetag

3. März 2015

Veröffentlichung

16. Mai 2018

Erteilung

16. Mai 2018

Rechtsraum

EP

IPC

H01L27/146H01L31/0203H01L31/0216

Abstract

Method of encapsulating a semiconductor structure (1) comprising providing (301) a semiconductor structure (1) comprising an opto-electric element (2) located in a cavity (3) formed between a substrate (4) and a cap layer (5), the cap layer being made of a material transparent to light, and having a flat upper surface; forming at least one protrusion (7) on the cap layer (5); bringing (303) the at least one protrusion (7) of the cap layer in contact with a tool (8) having a flat surface region, and applying a non-transparent material (9) to the semiconductor structure (1) where it is not in contact with the tool (8); and removing (304) the tool thereby providing an encapsulated optical semiconductor device (10) having a transparent window (11) integrally formed with the cap layer (5).

Anmelder

Firma

Melexis Technologies NV

Land

🇧🇪 Belgien

Fachgebiete