Schutz von Porösen Substraten bei Plasmaätzen

Details

Veröffentlichungs-Nr.

EP3070735

Aktenzeichen

EP15159463

Anmeldetag

17. März 2015

Veröffentlichung

18. November 2020

Erteilung

18. November 2020

Rechtsraum

EP

IPC

H01L21/311H01L21/3105H01L21/768H01J37/32

Abstract

Method for etching a porous material (3) in an environment, said method comprising the successive steps of I. contacting a porous material (3) with an organic gas (11g) in an environment having a pressure P1 and a temperature T1, wherein said organic gas (11g) is such that at said pressure P1 and at said temperature T1 it remains a gas when outside of said porous material (3) but condenses as an organic liquid (11l) when in contact with said porous material (3), thereby filling pores (12) of said porous material (3) with said organic liquid (11l); II. plasma etching treatment of said porous material (3) having filled pores (12), thereby evaporating a fraction of said organic liquid (11l) filling the pores of said porous material (3), said successive steps being repeated n times with n with n ¥ 1.

Anmelder

Firmen

IMEC VZW
Katholieke Universiteit Leuven

Land

🇧🇪 Belgien

Fachgebiete