Flüssigkeitskühlung Elektronischer Vorrichtungen

Details

Veröffentlichungs-Nr.

EP3188230

Aktenzeichen

EP15203217

Anmeldetag

30. Dezember 2015

Veröffentlichung

2. September 2020

Erteilung

2. September 2020

Rechtsraum

EP

IPC

H01L23/473

Abstract

A liquid cooling system for cooling an electronic device comprising a chip or a chip package comprising a chip is described. The liquid cooling system comprises an inlet plenum comprising a coolant feeding channel oriented substantially parallel with the plane of a main surface to be cooled of the chip and a plurality of inlet cooling channels fluidically connected to the coolant feeding channel and arranged vertically for impinging a liquid coolant directly on said main surface of the chip. The vertically oriented inlet cooling channels are substantially parallel to vertically oriented outlet cooling channels and are separated by a thermally isolating material. The liquid cooling system further comprises at least one cavity wherein a plurality of inlet and outlet cooling channels end. The cavity is arranged for allowing interaction between the liquid coolant and the main surface of the chip and thus comprises a heat transfer region.

Anmelder

Firma

IMEC VZW

Land

🇧🇪 Belgien

Fachgebiete